
Mg Doped p-GaN Epitaxy Wafer Supplier
p-GaN on SiC/ p-GaN on Si
Substrate Size: 4 inch,6 inch,8 inch
Substrate Thickness: 500um/675um
p-GaN Cap Layer: 90-100nm
Product Description
HMT company produces p-GaN on SiC and p-GaN on Si Epi Wafer to worldwide semiconductor companies and research labs. We supply 4'' 6'' and 8'' pGaN Epi Wafers and support customization.
The enhanced-mode p-GaN gate HEMT achieves intrinsic normally-off operation by incorporating a p-type GaN layer in the gate region of the AlGaN/GaN heterostructure. This design enables complete device turn-off at zero to negative bias, making it an ideal solution for high-voltage, high-power applications.
Compared to conventional D-mode devices, the E-mode p-GaN HEMT demonstrates superior performance in:
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Threshold gate voltage characteristics
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Switching performance
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Operational reliability
Furthermore, its MOSFET-like driving mechanism significantly simplifies system design requirements.

With the GaN device market rapidly expanding, enhanced-mode p-GaN HEMTs are becoming the technology of choice for:
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Electric vehicles (EVs)
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Solar inverters
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Data center power systems
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5G base station RF frontends
Emerging dielectric and ferroelectric layers are expected to further enhance threshold voltage control and reliability, unlocking new innovations in GaN power devices.
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