Home | 中文 English
  • Home
  • About Us
  • Products
  • News
  • Success Cases
  • Services
  • Contact Us
  • GaN Substrate Wafer
  • Free-Standing GaN
  • GaN-On-Sapphire Template
  • GaN Epitaxial Wafer
  • GaN HEMT Chip Class Wafer
Home > Products > GaN Epitaxial Wafer > 4inch RF GaN Epitaxy on Si Wafer Supplier

4inch RF GaN Epitaxy on Si Wafer Supplier

Type: D-Mode/E-Mode/RF
Substrate Diameter: 4-8 inch(111)
Substrate Thickness: 675,1000um
Cap Layer: SiN or GaN Cap

Product Description

HMT offers high-performance MOCVD-grown GaN on Silicon (GaN-on-Si) epitaxial wafers in 4-inch, 6-inch, and 8-inch configurations, engineered to deliver superior crystal quality, high uniformity, and exceptional reliability at competitive pricing.

Why cooperate with HMT?

  • Rapid wafer customization lead time.

  • Professional engineers optimize customers structural parameters

    The anti-breakage packaging ensures customers received wafers safe.



GaN is a third-generation semiconductor material (also known as a wide-bandgap semiconductor material) and holds significant advantages over Si and GaAs in terms of key parameters:

  1. The Johnson figure of merit (a comprehensive metric for evaluating semiconductor materials in power and frequency applications) for GaN and GaAs is 27.5 and 2.7, respectively, indicating GaN's clear superiority over GaAs.

  2. Compared to GaAs (bandgap: 1.43 eV), GaN has a bandgap of 3.4 eV—approximately 2.4 times wider than that of GaAs.

  3. GaN devices exhibit exponentially higher breakdown field strength, enabling operation at higher voltages.

  4. GaN materials demonstrate higher carrier drift velocity under high electric fields, allowing for greater operating current. In contrast, while GaAs has high electron mobility at low electric fields and room temperature, its mobility sharply declines and even turns negative under slightly higher electric fields, leading to a drastic drop in carrier drift velocity.

As a material for developing advanced radar systems, jammers, and military electronic components such as T/R modules, gallium nitride (GaN) is now replacing gallium arsenide (GaAs).

For the same volume, GaN offers superior linearity, higher power density (>5 W/mm), better power performance (5–10x improvement), higher supply voltage (~50–70 V), higher saturation current, and broader frequency bandwidth, along with enhanced durability. Additionally, GaN enables stronger radiation power, extends detection range, reduces size and weight, improves mobility and battlefield survivability, shortens maintenance intervals, and enhances radar availability.


Related Products

  • RF GaN on HR Si Epi Wafer Supplier

  • GaN Cap AlGaN on Si Epi Wafer Supplier

  • GaN On Si Epi Wafer Power HEMT Manufacturer

  • 硅基氮化镓外延片-D-Mode耗尽型

  • E-HEMT GaN on Si Epi Wafer Manufacturer

  • 硅基HEMT氮化镓外延片E-Mode增强型

  • p-Cap GaN HEMT On Si Epi Wafer Supplier Mg

  • 8 inch GaN-on-Si Epitaxy Wafer Manufacturer

  • D-HEMT AlGaN/GaN on Si Epi Wafer Supplier

  • 4/6/8 inch GaN on Si Epi Wafer Manufacturer

  • u-GaN Cap On SiC For Power HEMT Supplier

  • D-Mode/E-Mode GaN on SiC Epi Wafers

  • HEMT GaN On SiC Epi Wafer Manufacturers

  • Power HEMT GaN on SiC Epi Wafer Manufacturer

  • AlGaN/GaN On SiC HEMT Epi Wafer Manufacturer

  • 4英寸碳化硅基氮化镓外延片

  • GaN On SiC Epi Wafer RF HEMT Manufacturer

  • 4 inch RF HEMT GaN-on-SiC Epi Wafer Manufacturer

  • AlGaN/GaN碳化硅基氮化镓外延片

  • GaN On Sapphire Epi Wafer Supplier For HEMT

  • GaN Epitaxial Wafer For LED

  • Home
  • About Us
  • Products
  • News
  • Success Cases
  • Services
  • Contact Us

M.P: +86-15366208370 ; +86-15366203573
E-mail: kim@homray-material.com;tina@homray-material.com
HMT Silicon Carbide (SiC) Wafer Website: www.sicwafer-hmt.com